Copolymer Extrusion PVDF for Electrical and Electronic Fields

Product Details
Customization: Available
Color: White
Appearance: Powder/Particle
Diamond Member Since 2025

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  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Copolymer Extrusion PVDF for Electrical and Electronic Fields
  • Overview
  • Product Description
  • Specification
Overview

Basic Info.

Model NO.
DS206C
Melting Point
140-145 ºC
Melt Flow Rate
1-25 G/10min
Tensile Strength
>35 MPa
Elongation Rate
>100 %
Thermal Deccomposition Temperature
>380 ºC
Moisture Content
<0.1 %
Relative Density
1.77-1.79
Hardness, Shore D
<60
Transport Package
Powder Packed in Plastic Bags
Specification
net content of 20kg per drum.
Trademark
Jiangsu Fuyuan New Material Co., Ltd
Origin
Shandong
HS Code
3904610000

Product Description

Product Description
Copolymer Extrusion PVDF for Electrical and Electronic Fields
Copolymer Extrusion PVDF DS206C
PVDF DS206C series copolymer resin product is a copolymer of powder or particle shaped polyvinylidene fluoride. Due to its excellent electrical insulation performance, good flexibility and excellent processability, it has become the preferred material for cables, functional films, heat shrink tubes and injection molded parts. It is mainly used in the electrical and electronic fields, or as an additive for application.
Specification
project
unit
DS206C Series ( L/M/H )
Test method or standard
Appearance
/
powder
Powder / granules
Powder / granules
Visual inspection
Melting point
140~145
155~160
160~165
GB/T 19466.3
Melt index
g/10min
1~25
1~25
1~25
GB/T 3682
Tensile Strength
MPa
≥ 35
≥ 35
≥ 35
GB/T 1040
Elongation at break
%
≥ 100
≥ 200
≥ 200
GB/T 1040
Thermal decomposition temperature
≥ 380
≥ 380
≥ 380
GB/T 33047
Moisture content
%
≤ 0.1
≤ 0.1
≤ 0.1
GB/T 6284
Relative density
/
1.77~1.79
1.77~1.79
1.77~1.79
GB/T 1033.1
Hardness, Shore D
/
≤ 60
≤ 70
≤ 80
GB/T 2411
Main applications
1.Mainly used for additives, optical films, cable materials and heat shrink tubes. 
2.Preparation of PVDF products through molding, extrusion and other processing processes.
Attention
The processing temperature should not exceed 350℃, to avoid decomposition and the generation of toxic gases.
Package, Transportation, Storage
1. Powder packed in plastic bags and placed in paper drums, with a net content of 20kg per drum. 
Particle packed in plastic bags, with a net content of 25kg per bag, or packed in antistatic bag, with a net content of 1000kg per bag. 
2. The product is transported according to non-dangerous product. 
3. It should be stored in a clean and dry environment at 5-30 °C to prevent impurities such as dust and water vapor from mixing in.
Copolymer Extrusion PVDF for Electrical and Electronic Fields
Copolymer Extrusion PVDF for Electrical and Electronic Fields
Copolymer Extrusion PVDF for Electrical and Electronic Fields
Copolymer Extrusion PVDF for Electrical and Electronic Fields
Copolymer Extrusion PVDF for Electrical and Electronic Fields

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