Durable FEP Resin for Pumps, Piping, and Heat Shrink Applications

• Customization: Available
• Color: Translucent Particle
• Appearance: Translucent Particle
• Model NO.: DS602/DS612/DS611/DS610
• Melting Index: 0.8-2.0 G/10min
• Tensile Stress: 28.0 MPa
• Fracture Strain: 320 %
• Relative Gravity: 2.12-2.17
• Melting Point: 265±10 ºC
• Dielectric Constant(10^6Hz),≤: 2.15
• Dielectric Factor (10^6Hz),≤: 7.0X10^-4
• Transport Package: Packed in Plastic Bag
• Specification: bag of 20kgs net each
• Trademark: Jiangsu Fuyuan New Material Co., Ltd.
• Origin: Shandong
• HS Code: 3904610000

Product Description

Product Description

Fluorinated Ethylene Propylene (FEP) Resin

Fluorinated ethylene propylene (FEP) resin has excellent properties, strong chemical stability, only weak resistance to strong oxidizing substances, high and low-temperature resistance, low coefficient of friction, good self-lubrication, excellent electrical insulation, stable dielectric constant, and strong weather resistance. In terms of processing, FEP is simpler and more efficient than PTFE.

Fluorinated ethylene propylene (FEP) resin has excellent properties, strong chemical stability, only weak resistance to strong oxidizing substances, high and low-temperature resistance, low coefficient of friction, good self-lubrication, excellent electrical insulation, stable dielectric constant, and strong weather resistance. In terms of processing, FEP is simpler and more efficient than PTFE. It is used in the electrical and electronic, chemical industries, aerospace, medical equipment and other fields .

Specification

project	unit	DS610			Test method or standard
		A	B	H
Appearance	/	Translucent particles, which must not contain impurities such as metal chips and sand particles, and the percentage of particles containing visible black spots shall not exceed 2 %			HG/T 2904
Melt index	g/10min	5.1-8.0	8.1-12.0	5.1-12.0	GB/T 3682
Tensile strength , ≥	Mpa	22.0		25.0	GB/T 1040
Elongation at break, ≥	%	310		330	GB/T 1040
Relative density	/	2.12-2.17			GB/T 1033
Melting point	℃	265±10			GB/T 28724
Dielectric constant (10 6 Hz ), ≤	/	2.15		2.07	GB/T 1409
( 10 6 Hz ), ≤	/	7.0×10 -4		5.7×10 -4	HG/T 1409
Resistance to thermal stress cracking	/	——		30000	ASTM/D 2176

Application

TDS611:Heat stress cracking resistant plastics,mainly for wire insulation layer,thin-walled tube.
DS602/DS612: The low melting index resin and heat stress cracking resistant moulding plastic, used for stress cracking resistant requiring and low or medium speed processing, mainly for heat shrinkable tubes,pumps, valves, piping and lining,wire insulation layer.
DS610: Extrusion processed for generic type resin, mainly used for wire insulation layer, tubes, film, and some of the bending properties have special requirement for the field, such asautomotive cable.

Attention

The processing temperature should not exceed 42℃,to prevent toxic gas from releasing.

Package, transportation and storage

1.Packed in plastic bag of 25kgs net each.
2.Stored in clean,cool and dry places, avoid contamination from foreign substance such as dust and moisture.
3.Nontoxic,noninflammable, inexplosive, no corrosion, the product is transported according to non-dangerous product.